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HM7065 bảng dữ liệu(PDF) 4 Page - Shenzhen Huazhimei Semiconductor Co., Ltd |
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HM7065 bảng dữ liệu(HTML) 4 Page - Shenzhen Huazhimei Semiconductor Co., Ltd |
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4 / 7 page ![]() the feedback network must tie directly to the AGND pin. Connecting the network to the PGND can inject noise into the system and effect performance. The feedback network, resistors R1 and R2 must be connected to FB pin directly as closely as possible. And FB is a sensitive signal node, trace area at FB pin should be small. Please keep FB away from the inductor and SW switching node on the PCB layout to minimize copper trace connections that can inject noise into the system. 9 AGND I Analog Ground. The analog ground ties to all of the noise sensitive signals. Provide a clean ground for the analog control circuitry and should not be in the path of large currents. Return for output voltage set resistor divider. Connect this pin to PGND. 10 LBO O Low Battery Comparator Output (open drain). (1) I = input; O = output; P = power ABSOLUTE MAXIMUM RATINGS(1) PARAMETER SYMBOL RATINGS UNITS CE Voltage(2) VCE VOUT+0.3 V Other Pins Voltage(2) 6 V Power Dissipation(3) QFN2.1X2.1-10 PD@TA=25℃ 2.5 W Package Thermal Resistance(4) θ JA 50 °C /W θ JC 10 °C /W Operating Junction Temperature Range Tj 150 °C Lead Temperature(Soldering, 10 sec) Tsolder 260 °C Storage Temperature Range Tstg -65~150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability. (2) All voltages are with respect to network ground terminal. (3) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = [ TJ(MAX)-TA ]/ θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. (4) θJA is measured in the natural convection at TA=25℃ on a four-layer Chipower Evaluation Board 5 A, 500KHz Synchronous Boost Converter with Output Disconnect HM7065 |
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