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HM830 bảng dữ liệu(PDF) 1 Page - Shenzhen Huazhimei Semiconductor Co., Ltd |
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HM830 bảng dữ liệu(HTML) 1 Page - Shenzhen Huazhimei Semiconductor Co., Ltd |
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1 / 8 page ![]() 830 / 830 500V N-Channel MOSFET General Description This Power MOSFET is produced using SL semi‘s advanced planar stripe DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficiency switched mode power supplies, active power factor correction based on half bridge topology. Features • 5.0A, 500V, RDS(on) = 1.50Ω @VGS = 10 V • Low gate charge ( typical 20nC) •Fast switching • 100% avalanche tested • Improved dv/dt capability Absolute Maximum Ratings T C = 25°Cunless otherwise noted * Drain current limited by maximum junction temperature. Thermal Characteristics Symbol Parameter HM830 HM830F Units VDSS Drain-Source Voltage 500 V ID Drain Current - Continuous (TC = 25°C) 5.0 5.0* A - Continuous (TC = 100°C) 3.0 3.0 * A IDM Drain Current - Pulsed (Note 1) 20 20* A VGSS Gate-Source Voltage ± 30 V EAS Single Pulsed Avalanche Energy (Note 2) 305 mJ EAR Repetitive Avalanche Energy (Note 1) 7.6 mJ dv/dt Peak Diode Recovery dv/dt (Note 3) 4.5 V/ns PD Power Dissipation (TC = 25°C) 76 40 W - Derate above 25°C 0.6 0.32 W/°C TJ, TSTG Operating and Storage Temperature Range -55 to +150 °C TL Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds 300 °C Symbol Parameter HM830 HM830F Units RθJC Thermal Resistance, Junction-to-Case 1.2 3.65 °C/W RθCS Thermal Resistance, Case-to-Sink Typ. 0.5 -- °C/W RθJA Thermal Resistance, Junction-to-Ambient 62.5 62.5 °C/W TO-220 G S D TO-220F G S D ● ● ● ▲ ◀ ● ● ● ▲ ◀ S D G Shenzhen H&M Semiconductor Co.Ltd http://www.hmsemi.com |
Số phần tương tự - HM830 |
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Mô tả tương tự - HM830 |
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