IRDCiP2003A-C_ ____

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www.irf.com

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Table 1: Reference Design Bill of Materials

Refer to the following application notes for detailed guidelines and suggestions when

implementing iPOWIR Technology products:

AN-1028: Recommended Design, Integration and Rework Guidelines for International Rectifier’s

iPowIR Technology BGA and LGA and Packages

This paper discusses optimization of the layout design for mounting iPowIR BGA and LGA packages on

printed circuit boards, accounting for thermal and electrical performance and assembly considerations.

Topics discussed includes PCB layout placement, and via interconnect suggestions, as well as soldering,

pick and place, reflow, inspection, cleaning and reworking recommendations.

AN-1030: Applying iPOWIR Products in Your Thermal Environment

This paper explains how to use the Power Loss and SOA curves in the data sheet to validate if the

operating conditions and thermal environment are within the Safe Operating Area of the iPOWIR product.

AN-1047: Graphical solution for two branch heatsinking Safe Operating Area

Detailed explanation of the dual axis SOA graph and how it is derived.

Use of this design for any application should be fully verified by the customer. International Rectifier

cannot guarantee suitability for your applications, and is not liable for any result of usage for such

applications including, without limitation, personal or property damage or violation of third party

intellectual property rights.

IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105

TAC Fax: (310) 252-7903