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HD3SS213 bảng dữ liệu(PDF) 2 Page - Texas Instruments

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tên linh kiện HD3SS213
Giải thích chi tiết về linh kiện  HD3SS213 5.4-Gbps DisplayPort 1.2a 2:1 and 1:2 Differential Switch
PDF  29 Pages
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HD3SS213 bảng dữ liệu(HTML) 2 Page - Texas Instruments

  HD3SS213 Datasheet HTML 1Page - Texas Instruments HD3SS213 Datasheet HTML 2Page - Texas Instruments HD3SS213 Datasheet HTML 3Page - Texas Instruments HD3SS213 Datasheet HTML 4Page - Texas Instruments HD3SS213 Datasheet HTML 5Page - Texas Instruments HD3SS213 Datasheet HTML 6Page - Texas Instruments HD3SS213 Datasheet HTML 7Page - Texas Instruments HD3SS213 Datasheet HTML 8Page - Texas Instruments HD3SS213 Datasheet HTML 9Page - Texas Instruments Next Button
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Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 5
6.1 Absolute Maximum Ratings........................................ 5
6.2 ESD Ratings............................................................... 5
6.3 Recommended Operating Conditions.........................5
6.4 Thermal Information....................................................6
6.5 Electrical Characteristics.............................................6
6.6 Timing Requirements..................................................7
6.7 Typical Characteristics................................................ 9
7 Detailed Description......................................................10
7.1 Overview................................................................... 10
7.2 Functional Block Diagram......................................... 10
7.3 Feature Description...................................................11
7.4 Device Functional Modes..........................................11
8 Application and Implementation.................................. 12
8.1 Application Information............................................. 12
8.2 Typical Applications.................................................. 13
9 Layout.............................................................................16
9.1 Layout Guidelines..................................................... 16
9.2 Layout Example........................................................ 17
10 Device and Documentation Support..........................18
10.1 Receiving Notification of Documentation Updates..18
10.2 Support Resources................................................. 18
10.3 Trademarks.............................................................18
10.4 Electrostatic Discharge Caution..............................18
10.5 Glossary..................................................................18
11 Mechanical, Packaging, and Orderable
Information.................................................................... 18
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (December 2016) to Revision C (January 2021)
Page
• NOTE: The device in the MicroStar Jr. BGA packaging were redesigned using a laminate nFBGA package.
This nFBGA package offers datasheet-equivalent electrical performance. It is also footprint equivalent to the
MicroStar Jr. BGA. The new package designator in place of the discontinued package designator will be
updated throughout the datasheet......................................................................................................................1
• Changed u*jr BGA to nFBGA............................................................................................................................. 1
• Changed ZQE to ZXH.........................................................................................................................................3
• Changed u*jr ZQE to nFBGA ZXH. Updated thermal data.................................................................................6
• Changed u*jr BGA to nFBGA........................................................................................................................... 10
Changes from Revision A (September 2013) to Revision B (December 2016)
Page
• Added Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes
section, Application and Implementation section, Power Supply Recommendations section, Layout section,
Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.
............................................................................................................................................................................1
• Added A2 to J4 row in Pin Functions table......................................................................................................... 3
Changes from Revision * (September 2013) to Revision A (September 2013)
Page
• Deleted Ordering Information............................................................................................................................. 3
HD3SS213
SLAS901C – DECEMBER 2016 – REVISED JANUARY 2021
www.ti.com
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