ADPA1105

Data Sheet

Rev. 0 | Page 16 of 16

OUTLINE DIMENSIONS

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

SIDE VIEW

PIN 1

INDICATOR

32

9

16

17

24

25

8

0.30

0.25

0.20

5.10

5.00 SQ

4.90

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.45

0.40

0.35

3.20

3.10 SQ

3.00

3.50 REF

EXPOSED

PAD

1.35

1.25

1.15

0.050 MAX

0.035 NOM

0.203 REF

0.40

0.60 REF

COPLANARITY

0.08

SEATING

PLANE

PIN 1

INDICATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

Figure 53. 32-Lead Lead frame Chip Scale Package, Premolded Cavity [LFCSP_CAV]

5 mm × 5 mm Body and 1.25 mm Package Height

(CG-32-2)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature

Package Description

Package Option

ADPA1105ACGZN

−40°C to

+85°C

MSL3

32-Lead Lead Frame Chip Scale Package, Premolded Cavity

[LFCSP_CAV]

CG-32-2

ADPA1105ACGZN-R7

−40°C to

+85°C

MSL3

32-Lead Lead Frame Chip Scale Package, Premolded Cavity

[LFCSP_CAV]

CG-32-2

ADPA1105-EVALZ

Evaluation Board

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registered trademarks are the property of their respective owners.

D21925-10/20(0)