ADL9005

Data Sheet

Rev. 0 | Page 6 of 24

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

2

1

3

4

5

6

18

17

16

15

14

13

NC

GND

GND

NC

NC

NC

GND

GND

NC

ADL9005

TOP VIEW

(Not to Scale)

NOTES

1. NC = NO INTERNAL CONNECTION. NOTE THE DATA

SHOWN HEREIN WAS MEASURED WITH THESE PINS

EXTERNALLY CONNECTED TO THE RF AND DC GROUND.

2. EXPOSED PAD. THE EXPOSED PAD MUST BE CONNECTED

TO RF AND DC GROUND.

Figure 2. Pin Configuration

Table 8. Pin Function Descriptions

Pin No.

Mnemonic Description

1

resistor as defined in Table 9. Refer to Figure 74 for the bias resistor connection. See Figure 3 for

the interface schematic.

2, 6 to 10, 13, 14, 18 to 22

NC

No Internal Connection. Note the data shown herein was measured with these pins externally

connected to the RF and dc ground.

3, 5, 15, 17

GND

Ground. The GND pins must be connected to RF and dc ground. See Figure 4 for the interface

schematic.

4

schematic.

11

ACG1

AC Grounding 1. A capacitor is required on the ACG1 pin to provide low frequency decoupling.

Refer to Figure 74 for the capacitor value. See Figure 5 for the interface schematic.

12

ACG2

AC Grounding 2. A capacitor is required on the ACG2 pin to provide low frequency decoupling.

Refer to Figure 74 for the capacitor value. See Figure 5 for the interface schematic.

16

to 50 Ω. See Figure 6 for the interface schematic.

23

ACG3

AC Grounding 3. A capacitor is required on the ACG3 pin to provide low frequency decoupling.

Refer to Figure 74 for the capacitor value. See Figure 6 for the interface schematic.

24

AC Grounding 4 (ACG4). A capacitor is required on the ACG4 pin to provide low frequency

decoupling. Refer to Figure 74 for the capacitor value. See Figure 6 for the interface schematic.

EPAD

Exposed Pad. The exposed pad must be connected to RF and dc ground.