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ASPM34 bảng dữ liệu(PDF) 5 Page - ON Semiconductor |
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ASPM34 bảng dữ liệu(HTML) 5 Page - ON Semiconductor |
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5 / 15 page ![]() NFVA23512NP2T www.onsemi.com 5 ABSOLUTE MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Symbol Parameter Conditions Rating Unit INVERTER PART VPN Supply Voltage Applied between P−NU, NV, NW 900 V VPN(Surge) Supply Voltage (Surge) Applied between P−NU, NV, NW 1000 V VCES Collector−Emitter Voltage 1200 V ±IC Each IGBT Collector Current TC = 100°C, TJ ≤150°C, VDD ≥ 15 V (Note 4) 35 A ±ICP Each IGBT Collector Current (Peak) TC = 25°C, TJ ≤150°C, Under 1 ms Pulse Width (Note 4) 70 A PC Collector Dissipation TC = 25°C per One Chip (Note 4) 171 W TJ Operating Junction Temperature VCES = 960 V −40∼150 °C VCES = 1200 V −40∼125 CONTROL PART VDD Control Supply Voltage Applied between VDD(H), VDD(L) − COM 20 V VBS High−Side Control Bias Voltage Applied between VB(U)−VS(U), VB(V)−VS(V), VB(W)−VS(W) 20 V VIN Input Signal Voltage Applied between IN(UH), IN(VH), IN(WH), IN(UL), IN(VL), IN(WL) − COM −0.3∼VDD+0.3 V VFO Fault Output Supply Voltage Applied between VFO − COM −0.3∼VDD+0.3 V IFO Fault Output Current Sink Current at VFO pin 2 mA VSC Current Sensing Input Voltage Applied between CSC − COM −0.3∼VDD+0.3 V BOOTSTRAP DIODE PART VRRM Maximum Repetitive Reverse Voltage 1200 V IF Forward Current TC = 25°C, TJ ≤150°C (Note 4) 1.0 A IFP Forward Current (Peak) TC = 25°C, TJ ≤150°C, Under 1 ms Pulse Width (Note 4) 2.0 A TJ Operating Junction Temperature (Note 5) −40∼150 °C TOTAL SYSTEM tSC Short Circuit Withstand Time VDD = VBS ≤ 16.5 V, VPN ≤ 800 V, TJ = 150°C Non−repetitive 3 ms TSTG Storage Temperature −40∼150 °C VISO Isolation Voltage 60 Hz, Sinusoidal, AC 1 minute, Connection Pins to Heat Sink Plate 2500 Vrms Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 4. These values had been made an acquisition by the calculation considered to design factor. THERMAL RESISTANCE Symbol Parameter Conditions Min. Typ. Max. Unit Rth(j−c)Q Junction to Case Thermal Resistance (Note 5) Inverter IGBT part (per 1/6 module) − − 0.73 °C/W Rth(j−c)F Inverter FWD part (per 1/6 module) − − 1.26 °C/W Ls Package Stray Inductance P to NU, NV, NW (Note 6) − 32 − nH 5. For the measurement point of case temperature (TC), please refer to Figure 1. DBC discoloration and Picker Circle Printing allowed, please refer to application note AN−9190 (Impact of DBC Oxidation on SPM® Module Performance). 6. Stray inductance per phase measured per IEC 60747−15. |
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