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AD9986 bảng dữ liệu(PDF) 4 Page - Analog Devices

tên linh kiện AD9986
Giải thích chi tiết về linh kiện  4T2R Direct RF Transmitter and Observation Receiver
PDF  5 Pages
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Trang chủ  http://www.analog.com
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AD9986 bảng dữ liệu(HTML) 4 Page - Analog Devices

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AD9986
Preliminary Technical Data
Rev. PrA | Page 4 of 5
ABSOLUTE MAXIMUM RATINGS
Table 1.
Parameter
Rating
ISET, DACxP, DACxN, TDP, TDN
−0.3 V to AVDD2 + 0.3 V
VCO_COARSE, VCO_FINE,
VCO_VCM, VCO_VREG
−0.3 V to AVDD2_PLL + 0.3 V
ADC0P, ADC0N, ADC1P, ADC1N
−0.3 V to BVDD2 + 0.3 V
VCM0, VCM1
−0.3 V to RVDD2 + 0.3 V
CLKINP, CLKINN
−0.2 V to PLLCLKVDD1 + 0.2 V
ADCDRVN, ADCDRVP
−0.2 V to CLKVDD1 + 0.2 V
SERDINx±, SERDOUTx±
−0.2 V to SVDD1 + 0.2 V
SYSREFP, SYSREFN,
and SYNCxIN±
−0.2 V to +2.5 V
SYNCxOUT±, SYNCxIN±, RESET,
TXENx, RXENx, IRQx, CS, SCLK,
SDIO, SDO, TMU_REFN,
TMU_REFP, ADCx_SMON0,
ADCx_SMON1, ADCx_FD0,
ADCx_FD1, GPIOx
−0.3 V to DVDD1P8 + 0.3 V
AVDD2, AVDD2_PLL, BVDD2,
RVDD2, SVDD2_PLL, DVDD1P8
−0.3 V to +2.2 V
PLLCLKVDD1, AVDD1,
AVDD1_ADC, CLKVDD1,
FVDD1, DAVDD1, DVDD1_RT,
DCLKVDD1, SVDD1,
SVDD1_PLL
−0.2 V to +1.2 V
VNN1
−1.1 V to +0.2 V
Temperature
Maximum Junction (TJ)1
120°C
Storage Range
−40°C to +150°C
1
Do not exceed this temperature for any duration of time when the device is
powered.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
REFLOW PROFILE
The AD9986 reflow profile is in accordance with the JEDEC
JESD 20 criteria for Pb-free devices. The maximum reflow
temperature is 260°C.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. The use of appropriate
thermal management techniques is recommended to ensure that
the maximum TJ does not exceed the limits shown in Table 1.
θJA is the natural convection, junction-to-ambient thermal
resistance measured in a one cubic foot sealed enclosure.
θJC_TOP is the junction-to-case thermal resistance.
θJB is the junction-to-board thermal resistance.
Table 2. Thermal Resistance1
Package
Type
Airflow Velocity
(m/sec)
θJA
θJC_TOP
θJB
Unit
BP-324-3
0.0
11.7
0.40
2.3
°C/W
1
Thermal resistance values specified are simulated based on JEDEC specifications
in compliance with JESD51-12 with the device power equal to 9 W.
ESD CAUTION



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