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AD9986 bảng dữ liệu(PDF) 4 Page - Analog Devices |
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AD9986 bảng dữ liệu(HTML) 4 Page - Analog Devices |
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4 / 5 page ![]() AD9986 Preliminary Technical Data Rev. PrA | Page 4 of 5 ABSOLUTE MAXIMUM RATINGS Table 1. Parameter Rating ISET, DACxP, DACxN, TDP, TDN −0.3 V to AVDD2 + 0.3 V VCO_COARSE, VCO_FINE, VCO_VCM, VCO_VREG −0.3 V to AVDD2_PLL + 0.3 V ADC0P, ADC0N, ADC1P, ADC1N −0.3 V to BVDD2 + 0.3 V VCM0, VCM1 −0.3 V to RVDD2 + 0.3 V CLKINP, CLKINN −0.2 V to PLLCLKVDD1 + 0.2 V ADCDRVN, ADCDRVP −0.2 V to CLKVDD1 + 0.2 V SERDINx±, SERDOUTx± −0.2 V to SVDD1 + 0.2 V SYSREFP, SYSREFN, and SYNCxIN± −0.2 V to +2.5 V SYNCxOUT±, SYNCxIN±, RESET, TXENx, RXENx, IRQx, CS, SCLK, SDIO, SDO, TMU_REFN, TMU_REFP, ADCx_SMON0, ADCx_SMON1, ADCx_FD0, ADCx_FD1, GPIOx −0.3 V to DVDD1P8 + 0.3 V AVDD2, AVDD2_PLL, BVDD2, RVDD2, SVDD2_PLL, DVDD1P8 −0.3 V to +2.2 V PLLCLKVDD1, AVDD1, AVDD1_ADC, CLKVDD1, FVDD1, DAVDD1, DVDD1_RT, DCLKVDD1, SVDD1, SVDD1_PLL −0.2 V to +1.2 V VNN1 −1.1 V to +0.2 V Temperature Maximum Junction (TJ)1 120°C Storage Range −40°C to +150°C 1 Do not exceed this temperature for any duration of time when the device is powered. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. REFLOW PROFILE The AD9986 reflow profile is in accordance with the JEDEC JESD 20 criteria for Pb-free devices. The maximum reflow temperature is 260°C. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. The use of appropriate thermal management techniques is recommended to ensure that the maximum TJ does not exceed the limits shown in Table 1. θJA is the natural convection, junction-to-ambient thermal resistance measured in a one cubic foot sealed enclosure. θJC_TOP is the junction-to-case thermal resistance. θJB is the junction-to-board thermal resistance. Table 2. Thermal Resistance1 Package Type Airflow Velocity (m/sec) θJA θJC_TOP θJB Unit BP-324-3 0.0 11.7 0.40 2.3 °C/W 1 Thermal resistance values specified are simulated based on JEDEC specifications in compliance with JESD51-12 with the device power equal to 9 W. ESD CAUTION |
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