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AF126 bảng dữ liệu(PDF) 14 Page - 3M Electronics

tên linh kiện AF126
Giải thích chi tiết về linh kiện  Scotch-WeldTM Structural Adhesive Film
PDF  15 Pages
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nhà sản xuất  3M [3M Electronics]
Trang chủ  http://www.3m.com
Logo 3M - 3M Electronics

AF126 bảng dữ liệu(HTML) 14 Page - 3M Electronics

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3M™ Scotch-Weld™ Structural Adhesive Film AF 126 and AF 126 FR must be stored
at 0°F (-18°C) or lower. Allow these products to return to room temperature before using
to prevent moisture condensation on the adhesive surface or cracking during handling.
Refrigerated storage at 40°F ± 5°F (4°C ± 3°C) is suggested for 3M™ Scotch-Weld™
Structural Adhesive Primer EC-2320. Primer should be permitted to thoroughly warm to
room temperature before using in order to prevent moisture condensation.
Storage
The shelf life of Scotch-Weld AF 126 and AF 126 FR is 3 months at 0°F (-18°C) or
below.
The out times* is:
1. at 40°F (4°C) – 30 days
2. at 75°F (24°C) – 10 days
3. at 90°F (32°C) – 5 days
*as measured by peel test values.
Shelf Life
Scotch-WeldTM
Structural Adhesive Film
AF 126 • AF 126 FR
Product Application
(continued)
Cure Time
Cure time depends on the cure temperature used, methods of heat application,
production limitations and bond properties required. Since no two bonding operations
are exactly alike, it is suggested that a few simple experiments be conducted varying
both temperature and cure time to determine optimum conditions for the particular
application.
The following cure cycle is suggested to obtain dense glue lines and was used to obtain
the strengths reported in the Test Results section:
1. Apply a pressure of 50 psi (0.35 MPa) prior to reaching a bond line temperature of
150°F (66°C) and maintain throughout the cure cycle.
2. Raise the bond line temperature from ambient to 250°F (121°C).
3. Cure for 60 minutes at 250°F (121°C).
4. Cool to below 200°F (93°C) bond line temperature prior release of pressure.
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