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EC-3501 bảng dữ liệu(PDF) 2 Page - 3M Electronics

tên linh kiện EC-3501
Giải thích chi tiết về linh kiện  3M™ Scotch-Weld™ Epoxy Adhesives
PDF  6 Pages
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nhà sản xuất  3M [3M Electronics]
Trang chủ  http://www.3m.com
Logo 3M - 3M Electronics

EC-3501 bảng dữ liệu(HTML) 2 Page - 3M Electronics

  EC-3501 Datasheet HTML 1Page - 3M Electronics EC-3501 Datasheet HTML 2Page - 3M Electronics EC-3501 Datasheet HTML 3Page - 3M Electronics EC-3501 Datasheet HTML 4Page - 3M Electronics EC-3501 Datasheet HTML 5Page - 3M Electronics EC-3501 Datasheet HTML 6Page - 3M Electronics  
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Typical Cured Properties
Note: The following technical information and data should be considered representative or typical only and should not be used for
specification purposes.
Physical
Color
Gray
Shore D Hardness
75-80
Thermal
Electrical
Handling/Curing Information
Directions for Use
3M™ Scotch-Weld™ Epoxy Adhesive EC-3501 is supplied in bulk kits as well as side by side dual syringe plastic cartridges. To use the
cartridge system, simply insert the cartridge into the applicator. Next, remove the cartridge cap and expel a small amount of adhesive
to be sure both sides of the cartridge are flowing evenly and freely. If simultaneous mixing of Part A and Part B is desired, attach the
mixing nozzle to the cartridge and begin dispensing the adhesive.
When mixing Part A and Part B manually the components must be mixed in the ratio indicated in the typical uncured properties section of
this data sheet. Complete mixing of the two components is required to obtain optimum properties.
Two-part mixing/proportioning/dispensing equipment is available for intermittent or production line use. These systems are ideal for line
uses because of their variable shot size and flow rate characteristics and are adaptable to most applications.
Apply adhesive to clean, dry surfaces, join parts and secure until adhesive sets (see rate of strength build up).
These products may be applied by spatula, trowel, or flow equipment.
Surface Preparation
For highest strength structural bonds, paint, oxide films, oils, dust, mold release agents and all other surface contaminants must be
completely removed. The amount of surface preparation depends on the required bond strength and environmental aging resistance.
The following cleaning methods are suggested for these common surfaces. ASTM D2651 is suggested as a reference guide for surface
preparation for adhesive bonding for various substrates.
Steel
1. Wipe free of dust with oil-free solvent such as Methyl Ethyl Ketone (MEK).*
2. Sandblast or abrade using clean fine grit abrasives.
3. Wipe again with solvent to remove loose particles.
Aluminum
1. Wipe free of dust with oil-free solvent such as Methyl Ethyl Ketone (MEK).*
ThermalCoefficient of Expansion(in/in/°C)
60 x 10-6 (-50 to 10°C range)
234 x 10-6 (50 to 110°C range)
Thermal Conductivity btu - ft./ft.2 - hr. - °F
0.193
Dialectic Strength
700 volts/mil
Volume Resistivity
1.2 x 1013 ohm - cm



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