TMP139AIYAHT datasheet(4/58 Pages) TI

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Power supply, VDDIO

–0.5

2.1

Power supply, VDDSPD

–0.5

2.1

Input voltage SA

–0.5

2.1

Input voltage SCL, SDA

–0.5 VDDIO + 0.3

Output sink current SDA

±15

Junction temperature, TJ

–55

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

VDDIO

0.95

1.0

1.05

VDDSPD

1.7

1.8

1.98

I/O Voltage

VDDSPD +

0.3

SCL, SDA

VDDIO + 0.3

Operating free-air temperature, TA

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

TMP139

UNIT

YAH (WCSP)

6 PINS

RθJA

Junction-to-ambient thermal resistance

116.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

1.0

°C/W

RθJC(bottom)

Junction-to-case (bottom) thermal resistance

°C/W

RθJB

Junction-to-board thermal resistance

33.6

°C/W

ΨJT

Junction-to-top characterization parameter

0.4

°C/W

ΨJB

Junction-to-board characterization parameter

33.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TMP139

SNIS217 – DECEMBER 2020

www.ti.com

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