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Structural Adhesive Film

AF 555

Key Features

Available Constructions:

October 2007

a Sheet

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D

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3M™ Scotch-Weld™ Structural Adhesive Film AF 555 is a thermosetting, modi ed

epoxy adhesive lm. It was designed for bonding of composites in conjunction with

honeycomb or in a monolithic structure. Scotch-Weld AF 555 Film can be co-cured,

co-bonded with composite prepregs, or used to bond cured composite.

Product Description

Weight

Construction

Code:

U = Unsupported Film

M = Non-Woven Supporting Carrier (Matte)

K = Knit Supporting Carrier

L = Lightweight Non-Woven Supporting Carrier

Scotch-Weld AF 555 lms are orange in both their uncured and fully cured form.

2.5

5.5

6.0

8.0

10.0

13.0

2.5

5.5

5.75

6.0

8.0

10.0

13.0

8.0

13.0

16.0

8.0

Nominal

Thickness (mils)

0.015

0.030

0.035

0.050

0.060

0.080

0.015

0.030

0.0325

0.035

0.050

0.060

0.080

0.050

0.080

0.100

0.050

Scotch-Weld AF 555U Film

Scotch-Weld AF 555U Film

Scotch-Weld AF 555U Film

Scotch-Weld AF 555U Film

Scotch-Weld AF 555U Film

Scotch-Weld AF 555U Film

Scotch-Weld AF 555M Film

Scotch-Weld AF 555M Film

Scotch-Weld AF 555M Film

Scotch-Weld AF 555M Film

Scotch-Weld AF 555M Film

Scotch-Weld AF 555M Film

Scotch-Weld AF 555M Film

Scotch-Weld AF 555K Film

Scotch-Weld AF 555K Film

Scotch-Weld AF 555K Film

Scotch-Weld AF 555L Film

Excellent pre-bond humidity performance on composite substrates.

One-year out-time at ambient conditions.

Unsupported version available for reticulation.

Film adhesive can be cured from 300°F (150°C) up to 355°F (180°C).

Excellent shop handling characteristics (easy to use in shop).

Available with light-weight conductive screens for lightning strike/composite

surfacing applications.