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STPMIC1DPQR bảng dữ liệu(PDF) 57 Page - STMicroelectronics |
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STPMIC1DPQR bảng dữ liệu(HTML) 57 Page - STMicroelectronics |
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57 / 140 page ![]() Table 13. MAIN/ALTERNATE switch example configuration Regulator MAIN setting ALTERNATE setting Register value BUCKz(z=1..4) ENA=1 VOUT=1.2 V, PREG_MODE=HP ENA=1 VOUT=0.9 V PREG_MODE=LP BUCKx_MAIN_CR=0x61 BUCKx_ALT_CR=0x33 BUCKy(y=1..4) ENA=1 VOUT=3.3 V PREG_MODE=HP ENA=0, VOUT=3.3 V PREG_MODE=HP BUCKy_MAIN_CR=0xD9 BUCKy_ALT_CR=0xD8(or 0x00) LDOx(x=1,2,5,6) ENA=1 VOUT=1.8 ENA=0 VOUT=1.8 LDOx_MAIN_CR=0x27 LDOx_ALT_CR=0x26 (or 0x00) Figure 60. Power mode switch sequence example MAIN MODE PWRCTRL VOUTz (Buck z) ALTERNATE MODE POWER_ON MAIN MODE 1.2 V 0.9 V VOUTy (Buck y) 3.3 V 0 V VLDOxOUT (LDO x) 1.8 V 0 V tSD (BUCK y) tSU (BUCK y) tSD (LDO x) 0.2 V 0.2 V tSS = ΔVOUTy x SR(BUCK Y) tSS = ΔVLDOxOUT x SR(LDO X) ΔVOUTz x SR(BUCK Z) ΔVOUTz x SR(BUCK Z) 5.4.6 Thermal protection The STPMIC1 implements a thermal protection to prevent over heating damage. Junction temperature is permanently monitored thanks to an embed cell. Protection consists of 2 thresholds : • Thermal shutdown threshold (TSHDN), which turns off the STPMIC1 • Thermal warning threshold (TWRN), which generates an interrupt to be handled by the application processor Figure 61. Thermal protection thresholds represents the distribution of those thresholds along the temperature curve. When the temperature rises above TSHDN_Rise, the STPMIC1 starts a rank down and goes to CHECK&LOAD state. If temperature decreases and comes back lower than TSHDN_Fall, the STPMIC1 restarts automatically with POWER_UP sequence. In order to allow the application processor to anticipate TSHDN_Rise shutdown and take relevant actions, interrupts THW_RI and THW_FA are generated when the temperature rises above TWRN_Rise and falls down TWRN_Fall. Refer to Section 6.5 Interrupt registers about the interruption management. STPMIC1 Feature description DS12792 - Rev 7 page 57/140 |
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