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STM32G47PBY3TR bảng dữ liệu(PDF) 195 Page - STMicroelectronics

tên linh kiện STM32G47PBY3TR
Giải thích chi tiết về linh kiện  Arm® Cortex®-M4 32-bit MCUFPU, up to 512 KB Flash, 170 MHz / 213DMIPS, 128 KB SRAM, rich analog, math accelerator
PDF  229 Pages
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
Trang chủ  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32G47PBY3TR bảng dữ liệu(HTML) 195 Page - STMicroelectronics

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STM32G473xB STM32G473xC STM32G473xE
Package information
225
6
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
6.1
WLCSP81 package information
WLCSP81 is a 81-ball, 4.02x4.27 mm, 0.4 mm pitch wafer level chip scale package.
Figure 54. WLCSP81 - outline
1. Drawing is not to scale.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
4. Bump position designation per JESD 95-1, SPP-010.
B068_WLCSP81_DIE469_ME_V1
1
9
e1
e2
e
J
A
F
G
D
E
A
A2
A1
bbb Z
A3
A2
A1 BALL
LOCATION
DETAIL A
b
ccc
ddd
M
Z
Z
X Y
M
b(81x)
SEATING PLANE
z
BUMP
DETAIL A
ROTATED 90
eee Z
TOP VIEW
BOTTOM VIEW
FRONT VIEW
SIDE VIEW
A1
eee
(4X)



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