6.3

Reflow soldering

The BlueNRG-M2 is a high temperature strength surface mount Bluetooth® module supplied on a 23-pin

(BLUENRG-M2SA) or 20 pin (BLUENRG-M2SP), 4-layer PCB. The final assembly recommended reflow profiles

are indicated here below.

Soldering phase has to be executed with care: in order to avoid undesired melting phenomenon, particular

attention has to be taken on the set up of the peak temperature.

Here are some suggestions for the temperature profile based on the following recommendations.

Profile feature

PB-free assembly

3°C/ s max.

Preheat

150 °C

200 °C

60-100 s

Time maintained above:

217 °C

60-70 s

245 (-0) °C

min. 30 s

Ramp down rate

6 °C/s

Time from 25 °C to peak temperature

8 minutes max.

BlueNRG-M2

Reflow soldering

DS13053 - Rev 2

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