LM393D datasheet(6/55 Pages) TI

6 / 55 page

7.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage, VS = (V+) – (V–)

non-V devices

V devices

"B" version devices

Input voltage range, VIVR

non-B devices

(V+) – 2.0

"B" version devices

–0.1

Ambient temperature, TA

LM193

–55

125

°C

LM2903, LM2903V, LM2903AV, LM2903B

–40

125

LM393B

–40

LM293, LM293A

–25

LM393, LM393A

7.4 Thermal Information: LM193

THERMAL METRIC(1)

LM193

UNIT

(SOIC)

8 pin

RθJA

Junction-to-ambient thermal resistance

126.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

°C/W

RθJB

Junction-to-board thermal resistance

64.9

°C/W

ψJT

Junction-to-top characterization parameter

20.3

°C/W

ψJB

Junction-to-board characterization parameter

64.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.5 Thermal Information: LM293, LM393, LM2903 (all 'V' and 'A' suffixes)

THERMAL METRIC(1)

LM293, LM393, LM2903

UNIT

(SOIC)

DGK

(VSSOP)

(PDIP)

(SO)

(TSSOP)

8 pin

RθJA

Junction-to-ambient thermal resistance

131.8

199.4

73.7

139

194.1

°C/W

RθJC(top) Junction-to-case (top) thermal resistance

78.4

90.2

62.6

98.9

77.0

°C/W

RθJB

Junction-to-board thermal resistance

72.2

120.8

50.8

83.7

123.0

°C/W

ψJT

Junction-to-top characterization parameter

26.5

21.5

39.2

47.4

13.1

°C/W

ψJB

Junction-to-board characterization parameter

71.1

119.1

50.7

121.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V

SLCS005AD – OCTOBER 1979 – REVISED OCTOBER 2020

www.ti.com

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Product Folder Links: LM393B LM2903B LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V

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