ADMV4530 datasheet(7/59 Pages) AD

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Data Sheet

ADMV4530

Rev. A | Page 7 of 59

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

VCC_DRV, VCC_AMP, and VCC2_DRV

5 V

VCC_IF, VCC2_IF, VCC_VVA, VCC_MIXER,

VCC_DOUBLER, VCC_BG

4.3 V

VCC_VCO, VCC_DIV, VCC_LDO, VCC_CP

3.6 V

VCC_1P8V

2.3 V

REF_IN to GND

−0.3 V to +2.1 V

Input Power

10 dBm

I/Q

5 dBm

Temperature

Junction

125°C

Lifetime at Maximum Junction (TJ)

106 hours

Operating Range

−40°C to +85°C

Storage Range

−55°C to +150°C

Lead Range (Soldering 60 sec)

260°C

Moisture Sensitivity Level (MSL) Rating

MSL3

Electrostatic Discharge (ESD) Sensitivity

Human Body Model (HBM)

1000 V

Field Induced Charged Device

Model (FICDM)

1000 V

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure.

θJC is the junction to case thermal resistance.

Only use θJA and θJC to compare the thermal performance of

different packages when all test conditions listed are similar to

JEDEC specifications. Otherwise, use ΨJT and ΨJB to calculate

the device junction temperature using the following equations:

TJ = (P × ΨJT) + TTOP

(1)

where:

P is the total power dissipation in the chip (W).

ΨJT is the junction to top thermal characterization number.

TTOP is package top temperature (°C). TTOP is measured at the

top center of the package.

TJ = (P × ΨJB) + TBOARD

(2)

where:

P is the total power dissipation in the chip (W).

ΨJB is the junction to board thermal characterization number.

TBOARD is the board temperature measured on the midpoint of

the longest side of the package, no more than 1 mm from the

edge of the package body (°C).

As stated in JEDEC51-12, only use Equation 1 and Equation 2

when no heat sink or heat spreader is present. When a heat sink

or heat spreader is added, use θJC_TOP or θJC_BOT to estimate or

calculate the junction temperature.

Table 5. Thermal Resistance

Package Type

θJC_BOT1

θJC_TOP1

ΨJT

ΨJB

θJA

Unit

CC-40-8

5.9

12.8

3.0

8.5

28.2

°C/W

See JEDEC Standard JESD51-2 for additional information on optimizing the

thermal impedance.

ESD CAUTION

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