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MPX5700AS bảng dữ liệu(PDF) 6 Page - NXP Semiconductors

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MPX5700
Sensors
6
Freescale Semiconductor, Inc.
Pressure
PACKAGE DIMENSIONS
PIN 1
F
G
N
L
R
12
34
5
6
6 PL
D
SEATING
PLANE
-T-
M
A
M
0.136 (0.005)
T
POSITIVE PRESSURE
(P1)
C
B
M
J
S
-A-
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
STYLE 3:
PIN 1. OPEN
2. GROUND
3. +VOUT
4. +VSUPPLY
5. -VOUT
6. OPEN
STYLE 2:
PIN 1. OPEN
2. GROUND
3. -VOUT
4. VSUPPLY
5. +VOUT
6. OPEN
MAX
MILLIMETERS
INCHES
16.00
13.56
5.59
0.84
1.63
0.100 BSC
2.54 BSC
0.40
18.42
30˚ NOM
30˚ NOM
12.57
11.43
DIM
A
B
C
D
F
G
J
L
M
N
R
S
MIN
0.595
0.514
0.200
0.027
0.048
0.014
0.695
0.475
0.430
0.090
MAX
0.630
0.534
0.220
0.033
0.064
0.016
0.725
0.495
0.450
0.105
MIN
15.11
13.06
5.08
0.68
1.22
0.36
17.65
12.07
10.92
2.29
2.66
NOTES:
1.
2.
3.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
CASE 867-08
ISSUE N
BASIC ELEMENT
NOTES:
1.
2.
DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
CONTROLLING DIMENSION: INCH.
R
X
12
3
4
5
6
PORT #2 VACUUM (P2)
PORT #1 POSITIVE
PRESSURE (P1)
PORT #1
POSITIVE
PRESSURE
(P1)
PIN 1
PORT #2
VACUUM
(P2)
SEATING
PLANE
SEATING
PLANE
-T-
-T-
P
G
C
J
N
B
F
D 6 PL
W
V
L
U
S
K
-Q-
-A-
M
Q
M
0.25 (0.010)
T
M
A
M
0.13 (0.005)
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
1.145
1.175
29.08
29.85
B
0.685
0.715
17.40
18.16
C
0.405
0.435
10.29
11.05
D
0.027
0.033
0.68
0.84
F
0.048
0.064
1.22
1.63
G
0.100 BSC
2.54 BSC
J
0.014
0.016
0.36
0.41
K
0.695
0.725
17.65
18.42
L
0.290
0.300
7.37
7.62
N
0.420
0.440
10.67
11.18
P
0.153
0.159
3.89
4.04
Q
0.153
0.159
3.89
4.04
R
0.063
0.083
1.60
2.11
S
U
0.910 BSC
23.11 BSC
V
0.182
0.194
4.62
4.93
W
0.310
0.330
7.87
8.38
X
0.248
0.278
6.30
7.06
0.220
0.240
5.59
6.10
CASE 867C-05
ISSUE F
PRESSURE AND VACUUM SIDES PORTED (DP)



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