MPX5050

Sensors

Freescale Semiconductor

5

Pressure

On-chip Temperature Compensation and Calibration

the basic chip carrier (Case 867). A fluorosilicone gel isolates

the die surface and wire bonds from the environment, while

allowing the pressure signal to be transmitted to the sensor

diaphragm.

The MPX5050/MPXV5050G series pressure sensor

operating characteristics, and internal reliability and

qualification tests are based on use of dry air as the pressure

media. Media, other than dry air, may have adverse effects on

sensor performance and long-term reliability. Contact the

factory for information regarding media compatibility in your

application.

Figure 2 shows the sensor output signal relative to

pressure input. Typical, minimum, and maximum output

curves are shown for operation over a temperature range of

output will saturate outside of the specified pressure range.

interfacing the output of the integrated sensor to the A/D input

of a microprocessor or microcontroller. Proper decoupling of

the power supply is recommended.

Figure 2. Output vs. Pressure Differential

Figure 3. Cross-Sectional Diagram (not to scale)

Figure 4. Recommended Power Supply Decoupling and Output Filtering

(For additional output filtering, please refer to Application Note AN1646)

Differential Pressure (kPa)

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0

0

5

10

15

20

25

30

35

40

45

55

50

Transfer Function:

TEMP = 0 to 85°C

TYPICAL

MIN

MAX

Fluorosilicone

Gel Die Coat

Wire Bond

Die

P1

Stainless Steel

Metal Cover

Lead Frame

Die

Bond

Epoxy

Plastic

Case

P2

Differential/Gauge Element

+5 V

1.0

μF

0.01

μF

470 pF

GND

IPS

OUTPUT