MXT1664T3 datasheet(69/98 Pages) MICROCHIP

69 / 98 page

MXT1664T3 2.0

 2018 Microchip Technology Inc.

DS40002054A-page 69

14.0

SPECIFICATIONS

14.1

Absolute Maximum Specifications

14.2

Recommended Operating Conditions

Vdd

3.6 V

VddIO

3.6 V

AVdd

3.6 V

XVdd (external)

10 V

Maximum continuous combined pin current, all GPIOn pins

80 mA

Voltage forced onto any pin

–0.3 V to Vdd/VddIO/AVdd + 0.3 V

Configuration parameters maximum writes

10,000

Maximum junction temperature

125

C

CAUTION!

Stresses beyond those listed under Absolute Maximum Specifications may cause permanent damage

to the device. This is a stress rating only and functional operation of the device at these or other

conditions beyond those indicated in the operational sections of this specification is not implied.

Exposure to absolute maximum specification conditions for extended periods may affect device

reliability.

Operating temperature

–40

C to +85C

Storage temperature

–60

C to +150C

Vdd

3.3V ±5%

VddIO

1.8V to 3.3V ±5% (I2C mode)

3.3 V ±5% (USB mode)

AVdd

3.3V ±5%

External XVdd – Static

6.1V to 9.5V (8.5 V recommended)

XVdd – With Voltage Booster enabled

6.2V Nominal, Band Gap Referenced

7.4V Nominal, Band Gap Referenced

8.5V Nominal, Band Gap Referenced (Recommended)

9.21V Nominal, Band Gap Referenced

Temperature slew rate

C/min

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