TESEO-LIV3F datasheet(33/37 Pages) STMICROELECTRONICS

tên linh kiện	TESEO-LIV3F

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DS12152 Rev 7

33/37

Teseo-LIV3F

Reflow soldering profile

The Teseo-LIV3F is a high temperature strength surface mount GNSS module supplied on a

18 pin, 6-layer PCB. The final assembly recommended reflow profiles are indicated here

below.

Soldering phase has to be executed with care: in order to avoid undesired melting

phenomenon, particular attention has to be taken on the set up of the peak temperature.

Here following some suggestions for the temperature profile based on following

recommendations.

Figure 10. Soldering profiles

Table 11. Soldering profile values

Profile feature

PB-free assembly

Average ramp-up rate (TSMAX to Tp)3 °C/sec max

Preheat:

– Temperature min (TSmin)

– Temperature max (TSmax)

–Time (tSmin to tSmax) (tS)

150 °C

200 °C

60-100 sec

Time maintained above:

– Temperature (TL)

–Time (tL)

217° C

60-70 sec

Peak temperature (TP)

245 +/- 5 °C

Time within 5 °C of actual peak temperature

(TP)

10-20 sec

Ramp-down rate

6 °C/sec

Time from 25 °C to peak temperature

8 minute max.

TESEO-LIV3F bảng dữ liệu(PDF) 33 Page - STMicroelectronics