Preliminary Datasheet

LP6288

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LP6288

Version 0.1 JAN.-2018

Absolute Maximum Ratings

Note 1



VLI, EN, SWI, SWO, BKI3, BKO3, LX1/CS to PGND --------------------------------------------------

−0.3V to +24V



SWI to SWO --------------------------------------------------------------------------------------------------------

−0.3V to +24V



VL, NTC, COMP, BKO1, BKI2, BKO2, DRVN, GATE to PGND ------------------------------------

−0.3V to +6V



SDA, SCL, Addr, HVS, GVOFF, RST to PGND --------------------------------------------------------

−0.3V to +6V



BKLX1, BKLX2, BKLX3 to PGND ---------------------------------------------------------------------------

−0.3V to (BKIx +0.3V)



BKLX1, BKLX2, BKLX3 to PGND(for 20ns) --------------------------------------------------------------

−2V to (BKIx +0.3V)



BST1 to BKLX1, BST3 to BKLX3 ----------------------------------------------------------------------------

−0.3V to +6V



VGH, VGHM, DRN, DRVP to PGND -----------------------------------------------------------------------

−0.3V to +40V



VGL to VL ----------------------------------------------------------------------------------------------------------

−24V to +0.3V



PGND to AGND --------------------------------------------------------------------------------------------------

−0.3V to +0.3V



------------------------------------------------------

−40

℃ to +150℃



Operation Ambient Temperature Range

--------------------------------------------------------------

−40°C to +85°C



Storage Temperature Range

----------------------------------------------------------------------------

−65°C to +150°C



Maximum Soldering Temperature (at leads, 10sec)

----------------------------------------------- +260°C



Maximum Junction Temperature

----------------------------------------------------------------------- +150°C

Note 1.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress

ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of

the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Thermal Information



Thermal Resistance

QFN-40 6x6,

θ

JA

---------------------------------------------------------------------------------------------- 37.19°C/W

QFN-40 6x6,

θ

JC

---------------------------------------------------------------------------------------------- 11.07°C/W