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IMXRT1060CEC bảng dữ liệu(PDF) 21 Page - NXP Semiconductors |
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IMXRT1060CEC bảng dữ liệu(HTML) 21 Page - NXP Semiconductors |
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21 / 111 page ![]() Electrical Characteristics i.MX RT1060 Crossover Processors for Consumer Products, Rev. 0.2, 02/2020 NXP Semiconductors 21 4.1.2 T hermal resistance 4.1.2.1 10 x 10 MM thermal resistance Table 9 shows the 10 x 10 MM package thermal resistance data. IO supply for GPIO in SDIO1 bank (3.3 V mode) NVCC_SD0 -0.3 3.6 V IO supply for GPIO in SDIO1 bank (1.8 V mode) -0.3 1.95 V IO supply for GPIO in SDIO2 bank (3.3 V mode) NVCC_SD1 -0.3 3.6 V IO supply for GPIO in SDIO2 bank (1.8 V mode) -0.3 1.95 V IO supply for GPIO in EMC bank (3.3 V mode) NVCC_EMC -0.3 3.6 V IO supply for GPIO in EMC bank (1.8 V mode) -0.3 1.95 V ESD damage Immunity: Human Body Model (HBM) Charge Device Model (CDM) Vesd — — 1000 500 V Input/Output Voltage range Vin/Vout -0.5 OVDD + 0.31 V Storage Temperature range TSTORAGE -40 150 o C 1 OVDD is the I/O supply voltage. Table 8. 10 x 10 MM thermal resistance data Rating Board type1 1 Thermal test board meets JEDEC specification for this package (JESD51-9). Symbol Value Unit Junction to Ambient Thermal resistance2 2 Determined in accordance to JEDEC JESD51-2A natural convection environment. Thermal resistance data in this report is solely for a thermal performance comparison of one package to another in a standardized specified environment. It is not meant to predict the performance of a package in an application-specific environment. JESD51-9, 2S2P RJA 40.8 oC/W Junction to Package Top Thermal resistance2 JESD51-9, 2S2P JT 0.5 oC/W Junction to Case Thermal Resistance3 3 Junction-to-Case thermal resistance determined using an isothermal cold plate. Case temperature refers to the mold surface temperature at eh package top side dead Centre. JESD51-9, 1S RJC 16.8 oC/W Table 7. Absolute maximum ratings (continued) |
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