TMCS1101 datasheet(4/48 Pages) TI1

4 / 48 page

TMCS1101

SBOS825A – SEPTEMBER 2019 – REVISED MAY 2020

www.ti.com

Product Folder Links: TMCS1101

Submit Documentation Feedback

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

GND – 0.3

NC Input

GND – 0.3

(VS) + 0.3

Analog output

VOUT

GND – 0.3

(VS) + 0.3

Junction temperature

–65

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

VIN+ and VIN– refer to the voltage at input current pins IN+ and IN–, relative to pin 5 (GND).

(2)

Input current safe operating area is constrained by junction temperature. Recommended condition based on the TMCS1101EVM. Input

current rating is derated for elevated ambient temperatures.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN+,VIN–

(1)

Input voltage

–600

600

VPK

Operating supply voltage, TMCS1101A1B-3U, A1U-3U

5.5

Operating supply voltage, TMCS1101A4B, A4U

4.5

5.5

(2)

Operating free-air temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

Applies when device mounted on TMCS1101EVM. For more details, see the Safe Operating Area section.

7.4 Thermal Information

THERMAL METRIC(1)

TMCS1101(2)

UNIT

D (SOIC)

8 PINS

RθJA

Junction-to-ambient thermal resistance

36.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

50.7

°C/W

RθJB

Junction-to-board thermal resistance

9.6

°C/W

ΨJT

Junction-to-top characterization parameter

–0.1

°C/W

ΨJB

Junction-to-board characterization parameter

11.7

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

TMCS1101 bảng dữ liệu(PDF) 4 Page - Texas Instruments

TMCS1101 bảng dữ liệu(HTML) 4 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

bảng dữ liệu tải về

Link URL