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REF4132 bảng dữ liệu(PDF) 9 Page - Texas Instruments

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tên linh kiện REF4132
Giải thích chi tiết về linh kiện  REF4132 Low-Drift, Low-Power, Small-Footprint Series Voltage Reference
PDF  25 Pages
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nhà sản xuất  TI1 [Texas Instruments]
Trang chủ  http://www.ti.com
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REF4132 bảng dữ liệu(HTML) 9 Page - Texas Instruments

Back Button REF4132 Datasheet HTML 5Page - Texas Instruments REF4132 Datasheet HTML 6Page - Texas Instruments REF4132 Datasheet HTML 7Page - Texas Instruments REF4132 Datasheet HTML 8Page - Texas Instruments REF4132 Datasheet HTML 9Page - Texas Instruments REF4132 Datasheet HTML 10Page - Texas Instruments REF4132 Datasheet HTML 11Page - Texas Instruments REF4132 Datasheet HTML 12Page - Texas Instruments REF4132 Datasheet HTML 13Page - Texas Instruments Next Button
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J
A
D
JA
T
T
P
R
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u
6
PRE
POST
HYST
NOM
| V
V
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V
10
ppm
V
§
·
u
¨
¸
©
¹
Time (hours)
0
100
200
300
400
500
600
700
800
900 1000
-40
-35
-30
-25
-20
-15
-10
-5
0
5
10
9
REF4132
www.ti.com
SNAS794 – MAY 2020
Product Folder Links: REF4132
Submit Documentation Feedback
Copyright © 2020, Texas Instruments Incorporated
8.2 Long-Term Stability
One of the key parameters of the REF4132 references is long-term stability. Typical characteristic expressed as:
curves shows the typical drift value for the REF4132 is 30 ppm from 0 to 1000 hours. This parameter is
characterized by measuring 32 units at regular intervals for a period of 1000 hours. It is important to understand
that long-term stability is not ensured by design and that the output from the device may shift beyond the typical
30 ppm specification at any time. For systems that require highly stable output voltages over long periods of
time, the designer should consider burning in the devices prior to use to minimize the amount of output drift
exhibited by the reference over time.
Figure 15. Long Term Stability - 1000 hours (VREF)
8.3 Thermal Hysteresis
Thermal hysteresis is measured with the REF4132 soldered to a PCB, similar to a real-world application.
Thermal hysteresis for the device is defined as the change in output voltage after operating the device at 25°C,
cycling the device through the specified temperature range, and returning to 25°C. The PCB was baked at 150°C
for 30 minutes before thermal hysteresis was measured. Hysteresis can be expressed by Equation 1:
where
•
VHYST = thermal hysteresis (in units of ppm)
•
VNOM = the specified output voltage
•
VPRE = output voltage measured at 25°C pre-temperature cycling
•
VPOST = output voltage measured after the device has cycled from 25°C through the specified temperature
range of –40°C to +125°C and returns to 25°C.
(1)
8.4 Power Dissipation
The REF4132 voltage references are capable of source and sink up to 10 mA of load current across the rated
input voltage range. However, when used in applications subject to high ambient temperatures, the input voltage
and load current must be carefully monitored to ensure that the device does not exceeded its maximum power
dissipation rating. The maximum power dissipation of the device can be calculated with Equation 2:
where
•
PD is the device power dissipation
•
TJ is the device junction temperature
•
TA is the ambient temperature
•
RθJA is the package (junction-to-air) thermal resistance
(2)



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