9

HIP6601A, HIP6603A, HIP6604

Small Outline Exposed Pad Plastic Packages (EPSOIC)

INDEX

AREA

E

D

N

12

3

-B-

0.25(0.010)

C A

M

BS

e

-A-

L

B

M

-C-

A1

A

SEATING PLANE

0.10(0.004)

C

H

µ

0.25(0.010)

B

M

M

α

P1

12

3

P

BOTTOM VIEW

N

TOP VIEW

SIDE VIEW

M8.15B

8 LEAD NARROW BODY SMALL OUTLINE EXPOSED PAD

PLASTIC PACKAGE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A

0.056

0.066

1.43

1.68

-

A1

0.001

0.005

0.03

0.13

-

B

0.0138

0.0192

0.35

0.49

9

C

0.0075

0.0098

0.19

0.25

-

D

0.189

0.196

4.80

4.98

3

E

0.150

0.157

3.31

3.39

4

e

0.050 BSC

1.27 BSC

-

H

0.230

0.244

5.84

6.20

-

h

0.010

0.016

0.25

0.41

5

L

0.016

0.035

0.41

0.64

6

N8

8

7

α

-

P

-

0.090

-

2.286

11

P1

-

0.090

-

2.286

11

Rev. 0 6/00

NOTES:

1. Symbols are defined in the “MO Series Symbol List” in

Section 2.2 of Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or

gate burrs. Mold flash, protrusion and gate burrs shall not

exceed 0.15mm (0.006 inch) per side.

4. Dimension “E” does not include interlead flash or protrusions.

Interlead flash and protrusions shall not exceed 0.25mm

(0.010 inch) per side.

5. The chamfer on the body is optional. If it is not present, a

visual index feature must be located within the crosshatched

area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. The lead width “B”, as measured 0.36mm (0.014 inch) or

greater above the seating plane, shall not exceed a

maximum value of 0.61mm (0.024 inch).

10. Controlling dimension: MILLIMETER. Converted inch

dimensions are not necessarily exact.

11. Dimensions “P” and “P1” are thermal and/or electrical

enhanced variations. Values shown are maximum size of

exposed pad within lead count and body size.