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LND01 bảng dữ liệu(PDF) 2 Page - Microchip Technology |
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LND01 bảng dữ liệu(HTML) 2 Page - Microchip Technology |
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2 / 12 page ![]() LND01 DS20005696A-page 2 2017 Microchip Technology Inc. 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings† Drain-to-source Voltage ....................................................................................................................................... BVDSX Source-to-drain Voltage........................................................................................................................................ BVSDX Gate-to-source Voltage ............................................................................................................................ –12V to +0.6V Gate-to-drain Voltage ............................................................................................................................... –12V to +0.6V Operating Ambient Temperature, TA ................................................................................................... –25°C to +125°C † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS Electrical Specifications: TA = 25°C unless otherwise specified. (Note 1) Parameter Sym. Min. Typ. Max. Unit Conditions Drain-to-source Breakdown Voltage BVDSX 9 — — V VGS = –3V, IDS = 10 µA Source-to-drain Breakdown Voltage BVSDX 9 — — V VGD = –3V, ISD = 10 µA Gate-to-source Off Voltage VGS(OFF) –0.8 — –3 V VDS = 9V, IDS = 1 µA Source-to-gate Off Voltage VSG(OFF) –0.8 — –3 V VSD = 9V, ISD = 1 µA Gate-to-source Diode VGS –12 — 0.6 V IGS = ±1 µA Gate-to-drain Diode VGD –12 — 0.6 V IGD = ±1 µA Drain-to-source Leakage Current IDS(OFF) — — 1 µA VGS = –3V, VDS = 9V Source-to-drain Leakage Current ISD(OFF) — — 1 µA VGD = –3V, VSD = 9V Saturated Drain-to-source Current IDSS 300 — — mA VGS = 0V, VDS = 9V Saturated Source-to-drain Current ISDD 300 — — mA VGD = 0V, VSD = 9V Static Drain-to-source On-state Resistance RDS(ON) — 0.9 1.4 Ω VGS = 0V, IDS = 100 mA Static Source-to-drain On-state Resistance RSD(ON) — 0.9 1.4 Ω VGD = 0V, ISD = 100 mA Note 1: All DC parameters are 100% tested at 25°C unless otherwise stated. (Pulse test: 300 µs pulse, 2% duty cycle) 2: Specification is obtained by characterization and is not 100% tested. AC ELECTRICAL CHARACTERISTICS Electrical Specifications: TA = 25°C unless otherwise specified. (Note 2) Parameter Sym. Min. Typ. Max. Unit Conditions Forward Transconductance GFS 200 — — mmho VDS = 9V, IDS = 50 mA Input Capacitance CISS — 46 — pF VGS = –3V, VDS = 5V, f = 1 MHz Common Source Output Capacitance COSS — 32 — pF Reverse Transfer Capacitance CRSS — 23 — pF Turn-on Delay Time td(ON) — 3.8 — ns VDD = 9V, IDS = 100 mA, RGEN = 25Ω Rise Time tr — 11 — ns Turn-off Delay Time td(OFF) — 1 — ns Fall Time tf — 6.4 — ns Note 1: All DC parameters are 100% tested at 25°C unless otherwise stated. (Pulse test: 300 µs pulse, 2% duty cycle) 2: Specification is obtained by characterization and is not 100% tested. |
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