NB621 datasheet(2/14 Pages) MPS

2 / 14 page

NB621 – 8A, 25V, 600kHz SYNCHRONOUS STEP-DOWN CONVERTER WITH INTEGRATED LDO

NB621 Rev. 0.9

www.MonolithicPower.com

12/10/2013

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

Free Air Temperature (TA)

NB621EV

QFN28 (4mmx5mm)

N621EV

–20

°C to +85°C

* For Tape & Reel, add suffix –Z (e.g. NB621EV–Z);

For RoHS compliant packaging, add suffix –LF (e.g. NB621EV–LF–Z).

PACKAGE REFERENCE

TOP VIEW

BST

N/C

GND

SDRV

AGND VCC AAM

PGOOD

EN/SYNC

SELH

ENLDO

LDO

REGO

N/C

Exposed pad on

back side

connected to GND

ABSOLUTE MAXIMUM RATINGS (1)

Supply Voltage VIN .......................................28V

VSW ......................................–0.3V to VIN + 0.3V

VBS ..................................................... VSW + 6V

IVIN(RMS) ...........................................................3A

ISW(RMS) ...........................................................3A

All Other Pins................................ –0.3V to +6V

Continuous Power Dissipation

(TA=+25°C )

(2)

............................................................3.1W

Junction Temperature.............................. 150

°C

Lead Temperature ................................... 260

°C

Storage Temperature.............. –65

°C to +150°C

Recommended Operating Conditions

(3)

Supply Voltage VIN .......................... 5.5V to 25V

Output Voltage VOUT........................ 0.8V to 15V

Operating Junct. Temp (TJ)..... –20°C to +125°C

Thermal Resistance

(4)

θJA

θJC

4x5 QFN28..............................40.......9

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/ θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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