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INA381-Q1

SLYS041 – MARCH 2020

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Copyright © 2020, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

(3)

Input voltage may exceed the voltage shown without causing damage to the device if the current at that terminal is limited to 5 mA.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

6

V

Analog inputs (IN+, IN–)

(2)

–26

26

V

GND – 0.3

26

Analog input

CMPIN

GND – 0.3

V

CMPREF

GND – 0.3

Analog output

OUT

GND – 0.3

V

Digital input

RESET

GND – 0.3

V

Digital output

ALERT

GND – 0.3

6

V

Junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

HBM ESD Classification Level 2

±3000

V

Charged-device model (CDM), per AEC Q100-011

CDM ESD Classification Level C6

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Common-mode input voltage

–0.2

12

26

V

Operating supply voltage

2.7

5

5.5

V

TA

Operating free-air temperature

–40

+125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

INA381-Q1

UNIT

DGS (VSSOP)

10 PINS

Junction-to-ambient thermal resistance

188.6

°C/W

Junction-to-case (top) thermal resistance

78.1

°C/W

Junction-to-board thermal resistance

111.0

°C/W

Junction-to-top characterization parameter

17.5

°C/W

Junction-to-board characterization parameter

109.2

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W