S1PD datasheet(1/2 Pages) VISHAY

tên linh kiện	S1PD

Giải thích chi tiết về linh kiện	High Current Density Surface Mount Glass-Passivated Rectifiers

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0.000 (0.00)

0.012 (0.30)

0.013 (0.35)

0.004 (0.10)

0.018 (0.45)

0.006 (0.15)

0.045 (1.15)

0.033 (0.85)

0.036 (0.91)

0.024 (0.61)

0.016 (0.40)

0.032 (0.80)

0.053 (1.35)

0.041 (1.05)

0.012 (0.30) REF

0.105

(2.67)

0.025

(0.635)

0.100

(2.54)

0.030

(0.762)

0.050

(1.27)

Cathode band

0.142 (3.61)

0.126 (3.19)

0.158 (4.00)

0.146 (3.70)

0.086 (2.18)

0.074 (1.88)

0.087 (2.20)

0.103 (2.60)

Dimensions in inches

and (millimeters)

Case Style SMP

Maximum Ratings & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.

Parameter

Symbol

S1PA

S1PB

S1PD

S1PG

S1PJ

Unit

Device marking code

SA

SB

SD

SG

SJ

Maximum reverse voltage

VRM

50

100

200

400

600

V

Maximum average forward rectified current Fig.1

IF(AV)

1A

Peak forward surge current 10ms single half sine-wave

superimposed on rated load

IFSM

30

A

Typical thermal resistance (1)

R

θJA

105

R

θJL

15

°C/W

R

θJC

20

Operating junction temperature

TJ,

150

°C

Storage temperature

TSTG

–55 to +150

°C

Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.

Parameter

Symbol

Value

Unit

Maximum instantaneous forward voltage(2) at IF=1A, TJ=25°C

VF

1.1

V

at IF=1A, TJ=125°C

0.95

Maximum reverse current

TJ = 25°C

1.0

µA

at rated VR(2)

TJ =125°C

IR

50

Typical reverse recovery time at

at IF = 0.5A, IR = 1.0A, Irr = 0.25A

trr

1.8

µs

Typical junction capacitance at 4.0V, 1MHz

CJ

6.0

pF

Notes: (1) Thermal resistance from junction to ambient and junction to lead mounted on P.C.B. with 5.0 x 5.0mm copper pad areas. R

θJL is measured at the ter-

minal of cathode band. R

θJC is measured at the top centre of the body

(2) Pulse test: 300µs pulse width, 1% duty cycle

Features

• Very low profile - typical height of 1.0mm

• Ideal for automated placement

• Glass passivated chip junction

• For use in rectification, power supply, home appliances

and telecommunication

• High temperature soldering:

260°C maximum/10 seconds at terminals

• Meets MSL level 1 per J-STD-020C

Mechanical Data

Case: SMP

Terminals: Matte Tin plated (E3 Suffix) leads, solderable

per J-STD-002B and MIL-STD-750, Method 2026

Polarity: Color band denotes cathode end

Weight: 0.0009 oz., 0.024 g

Epoxy meets UL 94V-0 flammability rating

Mounting Pad Layout

S1PA thru S1PJ

Vishay Semiconductors

formerly General Semiconductor

High Current Density Surface Mount

Glass-Passivated Rectifiers

Reverse Voltage 50 to 600 V

Forward Current 1.0 A

Document Number 88917

www.vishay.com

23-Sep-04

1

New Product

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