SL2S5002FUD datasheet(8/35 Pages) NXP

tên linh kiện	SL2S5002FUD

Giải thích chi tiết về linh kiện	ICODE SLIX-L

PDF	35 Pages

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nhà sản xuất	NXP [NXP Semiconductors]

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SL2S5002_SL2S5102

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Product data sheet

COMPANY PUBLIC

Rev. 3.4 — 27 August 2012

193134

8 of 35

NXP Semiconductors

SL2S5002; SL2S5102

ICODE SLIX-L

8.1.1 Fail die identification

No inkdots are applied to the wafer.

Electronic wafer mapping (SECS II format) covers the electrical test results and

additionally the results of mechanical/visual inspection.

See Ref. 6 “General specification for 8” wafer on UV-tape with electronic fail die marking”.

8.1.2 Map file distribution

See Ref. 6 “General specification for 8” wafer on UV-tape with electronic fail die marking”.

Height uniformity

within a die

2 m

within a wafer

3 m

wafer to wafer

4 m

Bump flatness

1.5 m

Bump size

LA, LB

m  60 m

TEST, GND

m  60 m

variation

5 m

Under bump metallization

sputtered TiW

Table 4.

Wafer specification

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