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23

VSM0805

Vishay Foil Resistors

Document Number: 63061

Revision 17-Aug-04

• ISRAEL: foilsales.israel@vishay.com

• FRANCE/SWITZERLAND/SOUTHERN EUROPE: foilsales.eusouth@vishay.com

• AMERICAS: foilsales.usa@vishay.com

• ASIA/JAPAN: foilsales.asia@vishay.com • UK/HOLLAND/SCANDANAVIA: foilsales.eunorth@vishay.com • GERMANY/CZECH REPUBLIC/AUSTRIA: foilsales.eucentral@vishay.com

SALES

Bulk Metal

Discrete Surface Mount Chip Resistors

MODEL

CHIP SIZE

RESISTANCE VALUE

TOLERANCE

TERMINATION

PACKAGING

VSM

0805

RESISTANCE

LETTER

MULTIPLIER

T ± 0.01%

S - Lead (Pb)-free

T = Tape and

RANGE

DESIGNATOR

FACTOR

Q ± 0.02%

B - Tin/Lead

Reel

A ± 0.05%

W = Waffle

5Ω to <1KΩ

R

x 1.0

B ± 0.1%

PacK

Example: 249R00 = 249Ω

C ± 0.25%

D ± 0.5%

F ± 1.0%

T

W

L

D

T

W

L

1K to 12KΩ

K

Example: 10K000 = 10.0KΩ

FIGURE 3 - RECOMMENDED MOUNTING

CHIP

POWER MAXIMUM RESISTANCE MAXIMUM

SIZE

L

W

T

D

+ 70

RANGE

WEIGHT

Z*

G*

X*

(mW)

(V)

(

0805

0.080 (2.03)

0.050 (1.27) 0.025 (0.64) 0.015 (0.38)

50

22

5.5 - 12K

6

0.122 (3.10)

0.028 (0.70)

0.050 (1.27)

*Land Pattern Dimensions (Z, G, X) are per IPC-782A

TABLE 3 - CHIP SIZES AND SPECIFICATIONS in inches (millimeters)

TABLE 4 - ORDERING INFORMATION - VSM STYLE CHIP RESISTORS

FIGURE 2 - POWER DERATING CURVE

125

100

75

50

25

0

-75

–50

–25

0

+25

+50

+75

+100 +125 +150 +175

Ambient Temperature (°C)

–55°C

+70°C

Rated Power

Footprint

G

Z

X

Top View

Bottom View

Recommended Land Pattern

25% to 85% of T

A low profile solder fillet is recommended

to avoid unnecessary stresses along

top edge of metallization. IR and vapor

phase reflow are best. Avoid the use of

cleaning agents which could attack

epoxy resins, which form part of the

resistor construction.