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Giải thích chi tiết về linh kiện  Addendum contactless chip card module specification
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AFSC5G37D37 bảng dữ liệu(HTML) 2 Page - NXP Semiconductors

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© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 3.0 — 15 January 2009
2 of 6
NXP Semiconductors
SL2MOS5401
Addendum contactless chip card module specification
4. Limiting values
[1]
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any conditions other
than those described in the Operating Conditions and Electrical Characteristics section of this specification
is not implied.
[2]
This product includes circuitry specifically designed for the protection of its internal devices from the
damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be
taken to avoid applying greater than the rated maxima.
[3]
MIL-STD-883D, Method 3015.7, Human Body Model.
[4]
The voltage between LA and LB is limited by the on-chip voltage limitation circuitry (corresponding to
parameter ILA-LB).
Table 2.
Limiting values [1][2]
In accordance with the Absolute Maximum Rating System (IEC 60134).
Processing temperature: refer to “Contactless chip card module specification”
Symbol
Parameter
Conditions
Min
Max
Unit
Tstg
storage temperature
−25
+85
°C
VESD
electrostatic discharge voltage
[3]
-
±2kVpeak
Imax LA-LB maximum input peak current
−60
+60
mApeak
Tjop
operating junction temperature
−25
+85
°C
ILA-LB
input current
[4]
-30
mArms



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