The Fifth Generation, Ultra Small Size, Isolated DC-DC Converter

1.5Watt BTA Series

13

DC-DC Converter

BDD20081

203

9. Soldering Conditions

Soldering is to be executed under the following conditions.

1- Soldering Iron (DIP Type, SMD Type)

380°C 3sec.

2- Soldering Dip (DIP type)

260°C 10sec.

3- Reflow (SMD type)

Reflow Temp. Profile

Solder Sn-3Ag-0.5Cu

A

A'

B'

C

B

Soldering Dip Time(s)

Ty1

Ty2

TP

225

C

B'

B

1.0 to 5.0℃/s

Ty1 to Ty2:

1.0 to 4.0℃/s

Above 225℃:

TP:

Ty2:

Ty1:

1.0 to 3.0℃/s

40 to 100s

170±10℃

150±10℃

245℃max.

20 to 40s

A

A'

Do not vibrate the product during reflow.

Reflow can be done only once. (Please do not mount backside.)

NOTE: Eutectic soldering can be used within condition as above.

10. Material of Pin and case

Pin : Phosphor bronze (Ni Foundation Sn Plating)

Case : SPCC (Ni Plating)

11. Vibration / Shock Test

Vibration : 10 to 55Hz All Amplitude 1.52mmp-p (2 hours in each of 3 orthogonal axes)

Scanning time 15min.

Shock : Acceleration 100G (3 times in each of 3 orthogonal axes, Total 18 times )

Duration 6ms

12. Cleaning Condition

This product can not be washed whole. No clean solder paste is recommended for this product. When and if

cleaning should be necessary only for DIP type, use IPA and hand-wash only soldered surface by brush cleaning.

After cleaning be sure to dry up before using.