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RF-TVYSC33KCN bảng dữ liệu(PDF) 21 Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.

tên linh kiện RF-TVYSC33KCN
Giải thích chi tiết về linh kiện  The White LED which was fabricated using a blue chip and the phosphor, outline size
PDF  23 Pages
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nhà sản xuất  REFOND [SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.]
Trang chủ  http://www.refond.com/
Logo REFOND - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.

RF-TVYSC33KCN bảng dữ liệu(HTML) 21 Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.

Back Button RF-TVYSC33KCN Datasheet HTML 15Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. RF-TVYSC33KCN Datasheet HTML 16Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. RF-TVYSC33KCN Datasheet HTML 17Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. RF-TVYSC33KCN Datasheet HTML 18Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. RF-TVYSC33KCN Datasheet HTML 19Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. RF-TVYSC33KCN Datasheet HTML 20Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. RF-TVYSC33KCN Datasheet HTML 21Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. RF-TVYSC33KCN Datasheet HTML 22Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD. RF-TVYSC33KCN Datasheet HTML 23Page - SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.  
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REFONDLT: WI-E-045
A/3
REV: E/6
Tel: +86-755-27865464
Fax:+86-755-27809120
E-mail: lingtao@refondlt.com
Web: www.refondlt.com
PAGE: 21
TG-201706270501NP
Table 4-1 Storage
Conditions
Temperature
Humidity
Time
Storage
储存
Before Opening Aluminum Bag
30
75%
Within 1 Year From Date
After Opening Aluminum Bag
30
60%
24hours
24
Baking
60
5
-
24hours
24
(8) If the moisture absorbent material(silica gel)has faded away or the LEDs have exceeded the storage time,
baking treatment should be performed after unpacking and based on the following condition(65±5)℃ for
above 24 hours.
If the package is flatulence or damaged,please notify the sales staff to assist.
(9) Similar to most Solid state devices; LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical
Over Stress (EOS).
(10) The characteristic of this product is fragile. So when use the picking up nozzle in SMT process, the
pressure on the product should be as small as possible, ward off the big pressure damage the product.
Moreover, manual clamping of this product must control intensity.
(11)Other points for attention, please refer to our relevant information.



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