LM32 datasheet(2/24 Pages) NSC

2 / 24 page

Connection Diagram

TSSOP-14

20071102

Top View

National Package Number MTC14C

Order

Number

Package

Marking

Package

Number

Transport

Media

LM32CIMT

LM32

CIMT

MTC14C

94 units per

rail

LM32CIMTX

LM32

CIMT

MTC14C

2500 units in

tape and reel

Pin Description

Pin Number

Pin Name

Description

Typical Connection

1, 6, 7,12, 13,

No Connect

May be tied to V+, GND or left floating

GND

Ground

System ground

V+/+3.3V_SBY

Positive power supply pin

Connected system 3.3 V standby power and

to a 0.1 µF bypass capacitor in parallel with

100 pF. A bulk capacitance of approximately

10 µF needs to be in the near vicinity of the

LM32.

SWD

SensorPath Bus line; Open-drain

output

Super I/O, Pull-up resistor, 1.6k

ADD

Digital input - device number select

input for the serial bus device

number

Pull-up to 3.3 V or pull-down to GND resistor,

10k; must never be left floating

8, 10

D1-, D2-

Thermal diode analog voltage

output and negative monitoring

input

Remote Thermal Diode cathode

(THERM_DC) - Diode 1 should always be

connected to the processor thermal diode.

Diode 2 may be connected to an MMBT3904

or GPU thermal diode. A 100 pF capacitor

should be connected between respective D-

and D+ for noise filtering.

9, 11

D1+, D2+

Thermal diode analog current

output and positive monitoring input

Remote Thermal Diode anode (THERM_DA) -

Diode 1 should always be connected to the

processor thermal diode. Diode 2 may be

connected to an MMBT3904 or GPU thermal

diode. A 100 pF capacitor should be

connected between respective D- and D+ for

noise filtering.

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