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PSMN014-60LS bảng dữ liệu(PDF) 3 Page - Nexperia B.V. All rights reserved |
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PSMN014-60LS bảng dữ liệu(HTML) 3 Page - Nexperia B.V. All rights reserved |
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3 / 15 page ![]() PSMN014-60LS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 — 8 December 2011 2 of 14 NXP Semiconductors PSMN014-60LS N-channel DFN3333-8 60 V 14 m Ω standard level MOSFET 2. Pinning information 3. Ordering information 4. Limiting values Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 1S source SOT873-1 (DFN3333-8) 2S source 3S source 4 G gate 5,6,7,8 D drain mb D mounting base; connected to drain 1 234 8 765 Transparent top view S D G mbb076 Table 3. Ordering information Type number Package Name Description Version PSMN014-60LS DFN3333-8 plastic thermal enhanced very thin small outline package; no leads; 8 terminals SOT873-1 Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDS drain-source voltage Tj ≥ 25 °C; Tj ≤ 150 °C - 60 V VDGR drain-gate voltage Tj ≤ 150 °C; Tj ≥ 25 °C; RGS =20kΩ -60 V VGS gate-source voltage -20 20 V ID drain current VGS =10V; Tmb = 100 °C; see Figure 1 -28 A VGS =10V; Tmb =25 °C; see Figure 1 -40 A IDM peak drain current pulsed; tp ≤ 10 µs; Tmb =25°C; see Figure 3 - 180 A Ptot total power dissipation Tmb =25 °C; see Figure 2 -65 W Tstg storage temperature -55 150 °C Tj junction temperature -55 150 °C Tsld(M) peak soldering temperature - 260 °C Source-drain diode IS source current Tmb =25 °C - 40 A ISM peak source current pulsed; tp ≤ 10 µs; Tmb = 25 °C - 180 A Avalanche ruggedness EDS(AL)S non-repetitive drain-source avalanche energy VGS =10V; Tj(init) =25°C; ID =40A; Vsup ≤ 60 V; unclamped; RGS =50 Ω -42 mJ |
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