Advanced CMOS Logic – 74AC244

 

Octal 3-State Non-Inverting Buffer / Line Driver / Line Receiver in bare die form

Rev 1.0

24/04/19

Outputs Source/Sink 24mA

Low input current: 1µA

3-State outputs

 

 

 

 

Outputs directly interface CMOS, NMOS and TTL

Operating voltage range: 2.0V to 6.0V

 

 

 

 

 

Lower power consumption & higher speed

Function compatible with 74HC244

Features:

Ordering Information

The following part suffixes apply:

 

No suffix - MIL-STD-883 /2010B Visual Inspection

 

 

 

For High Reliability versions of this product please see

 

54AC244

 

 

 

 

Die Size (Unsawn)

1750 x 1700

 

 

 

 

69 x 67

µm

mils

Supply Formats:

Mechanical Specification

Default – Die in Waffle Pack (100 per tray capacity)

Sawn Wafer on Tape – On request

130 x 130

Minimum Bond Pad Size

5.12 x 5.12

µm

mils

Die Thickness

350 (±20)

13.78 (±0.79)

µm

mils

Top Metal Composition

Al 1%Si 1.1µm

Back Metal Composition

N/A – Bare Si

Unsawn Wafer – On request

Die Thickness <> 350µm(14 Mils) – On request

Assembled into Ceramic Package – On request

The 74AC244 is produced on a 1.5µm 5V CMOS process

combining high speed LSTTL performance with CMOS low

power. The device can be used as two 4-bit buffers or one

8-bit buffer & features non-inverting inputs with two output

enables, each controlling four of the 3-state outputs. The

device is designed to improve performance & density in

clock drivers, 3-state memory address drivers & bus

orientated transmitters and receivers. Inputs include clamp

diodes that enable the use of current limiting resistors to

directly accept TTL without use of pull-up resistors.

Description

Die Dimensions in µm (mils)

1750 (69)

Page 1 of 6 

www.siliconsupplies.com