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PACKAGE OUTLINE

C

SEE OPTIONAL

TERMINAL

8X

0.32

0.18

1.6 0.1

2X

1.5

0.9 0.1

6X 0.5

8X

0.4

0.2

0.05

0.00

0.8 MAX

A

2.1

1.9

B

2.1

1.9

0.32

0.18

0.4

0.2

(0.2) TYP

WSON - 0.8 mm max height

DSG0008A

PLASTIC SMALL OUTLINE - NO LEAD

4218900/C 04/2019

PIN 1 INDEX AREA

SEATING PLANE

0.08 C

1

4

5

8

PIN 1 ID

0.1

C A B

0.05

C

THERMAL PAD

EXPOSED

9

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 5.500

OPTIONAL TERMINAL

TYPICAL