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STM32L433CB bảng dữ liệu(PDF) 206 Page - STMicroelectronics

tên linh kiện STM32L433CB
Giải thích chi tiết về linh kiện  Ultra-low-power Arm® Cortex®-M4 32-bit MCUFPU, 100DMIPS, up to 256KB Flash, 64KB SRAM, USB FS, LCD, ext. SMPS
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
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STM32L433CB bảng dữ liệu(HTML) 206 Page - STMicroelectronics

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Package information
STM32L433xx
206/225
DS11449 Rev 5
Figure 56. WLCSP64 - 64-ball, 3.141 x 3.127 mm, 0.35 mm pitch wafer level chip scale
package recommended footprint
b(3)
0.190
0.220
0.250
0.0075
0.0087
0.0098
D
3.106
3.141
3.176
0.1223
0.1237
0.1250
E
3.092
3.127
3.162
0.1217
0.1231
0.1245
e
-
0.350
-
-
0.0138
-
e1
-
2.450
-
-
0.0965
-
e2
-
2.450
-
-
0.0965
-
F
-
0.3455
-
-
0.0136
-
G
-
0.3385
-
-
0.0133
-
aaa
-
-
0.100
-
-
0.0039
bbb
-
-
0.100
-
-
0.0039
ccc
-
-
0.100
-
-
0.0039
ddd
-
-
0.050
-
-
0.0020
eee
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Back side coating.
3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
Table 110. WLCSP64 recommended PCB design rules (0.35 mm pitch)
Dimension
Recommended values
Pitch
0.35 mm
Dpad
0.210 mm
Dsm
0.275 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening
0.235 mm
Stencil thickness
0.100 mm
Table 109. WLCSP64 - 64-ball, 3.141 x 3.127 mm, 0.35 mm pitch wafer level chip scale
package mechanical data (continued)
Symbol
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max
WLCSP49_A04Z_FP_V1
Dpad
Dsm



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