Multilayer Ceramic Capacitors

Approval Sheet

Page 10 of 10

ASC_1825 2220 2225_025I_DS

May. 2019

Lead-free: Soldering temperature = 235 to 260°C, de pending on product.

Maximum temperature = Minimum temperature (235°C)+

T+ Tolerance for oven process and

measurement(5 ~ 7°C)

Time at peak temperature = 10sec, Dwell above 217°C = 90sec, Ramping rate = 3°C/sec (heating) and

6°C/sec (heating).

Classification Reflow Profiles

time

For user: The peak temperature

must not exceed 260°C. The time

above 255°C must not exceed 15

seconds.

◙ Cooling

After soldering, cool the chips and the substrate gradually to room temperature. Natural cooling in air is

recommended to minimize stress in the solder joint. A cooling rate not exceeding 4°C per second should be

used when forced cooling is necessary.

◙ Cleaning

All flux residues must be removed by using suitable electronic-grade vapor-cleaning solvents to

eliminate contamination that could cause electrolytic surface corrosion. Good results can be obtained by

using ultrasonic cleaning of the solvent. The choice of the proper system is depends upon many factors such

as component mix, flux, and solder paste and assembly method. The ability of the cleaning system to remove

flux residues and contamination from under the chips is very important.

Chip Size

T

0805,1206

100 °C

1210, 1808, 1812,

1825, 2211, 2220, 2225

50°C

Soldering

Solder

Soldering

Reflow

235 – 260 °C

< 15 sec.

T