Approval Sheet

Page 6 of 11

ASC_WFxxS V01

Aug - 2018

SOLDERING CONDITION

The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260

C for

10 seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other discrete

components on the reverse (mixed PCBs).

Surface Mount Resistors are tested for solderability at 245

C during 5 seconds within lead-free solder bath. The

test condition for no leaching is 260

C for 30 seconds. Typical examples of soldering profile and condition that

provide reliable joints without any damage are given in Fig 3. and Table 1.

Fig. 3 Infrared soldering profile for Chip Resistors

Table 1. Infrared soldering condition for Chip Resistors

Temperature Condition

Exposure Time

Average ramp-up rate (217

C to 260C)

Less than 3

C/second

Between 150 and 200

C

Between 60-120 seconds

> 217

C

Between 60-150 seconds

Peak Temperature

260ºC +0/-5

C

Time within 245

C

Min. 30 seconds

Ramp-down rate (Peak to 217

C)

Less than 6

C/second

Time from 25

C to Peak

No greater than 480 seconds