Approval sheet

Page 2 of 9

ASC_WA04/06_V16

Apr-2014

FEATURE

1.

Small size and light weight

2.

Reduced size of final equipment

3.

Lower surface mounted assembly costs

4.

Higher component and equipment reliability

5.

RoHS compliant and lead free products.

APPLICATION

•

Consumer electrical equipment

•

EDP, Computer application

•

Telecom

DESCRIPTION

The resistors array is constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are

added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The

composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to

within tolerance by laser cutting of this resistive layer.

The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For

ease of soldering the outer layer of these end terminations is Tin (lead free) alloy.

Fig 1. Construction of a Chip-R array (convex Type)

Fig 2. Construction of a Chip-R array (concave Type)