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HX6656
9
PACKAGING
The 32K x 8 ROM is offered in a custom 36-lead flat pack
(FP), 28-Lead FP, or standard 28-lead DIP. Each package
is constructed of multilayer ceramic (Al
2O3) and features
internal power and ground planes. The 36-lead FP also
features a non-conductive ceramic tie bar on the lead
frame. The tie bar allows electrical testing of the device,
while preserving the lead integrity during shipping and
handling, up to the point of lead forming and insertion.
Ceramic chip capacitors can be mounted to the package to
maximize supply noise decoupling and increase board
packing density. These capacitors attach directly to the
internal package power and ground planes. This design
minimizes resistance and inductance of the bond wire and
package. All NC (no connect) pins should be connected
to VSS to prevent charge build up in the radiation
environment.
28-LEAD FP PINOUT
36-LEAD FP PINOUT
36-LEAD FLAT PACK
[1] Parts delivered with leads unformed
[2] At tie bar
[3] Lid tied to VSS
A
b
C
D
E
e
F
G
H
I
J
L
0.095 ± 0.014
0.008 ± 0.002
0.005 to 0.0075
0.650 ± 0.010
0.630 ± 0.007
0.025 ± 0.002 [2]
0.425 ± 0.005 [2]
0.525 ± 0.005
0.135 ± 0.005
0.030 ± 0.005
0.080 typ.
0.285 ± 0.015
M
N
O
P
R
S
T
U
V
W
X
Y
0.008 ± 0.003
0.050 ± 0.010
0.090 ref
0.015 ref
0.075 ref
0.113 ± 0.010
0.050 ref
0.030 ref
0.080 ref
0.005 ref
0.450 ref
0.400 ref
All dimensions are in inches [1]
Kovar
Lid [3]
Ceramic
Body
A
J
I
C
M
0.004
N
X
VDD
Optional
Capacitors
1
VSS
V
S
W
P
U
Y
VDD
VSS
O
T
R
Non-
Conductive
Tie-Bar
b
(width)
e
(pitch)
E
1
H
L
L
Top
View
22018131-001
VDD
NWE
A13
A8
A9
A11
NOE
A10
NCS
DQ7
DQ6
DQ5
DQ4
DQ3
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Top
View
VSS
VDD
NWE
CE
A13
A8
A9
A11
NOE
A10
NCS
DQ7
DQ6
DQ5
DQ4
DQ3
VDD
VSS
VSS
VDD
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
NC
VDD
VSS
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
Top
View
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