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LMV242MDA bảng dữ liệu(PDF) 4 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
tên linh kiện LMV242MDA
Giải thích chi tiết về linh kiện  Dual Output, Quad-Band GSM/GPRS Power Amplifier Controller
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nhà sản xuất  NSC [National Semiconductor (TI)]
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LMV242MDA bảng dữ liệu(HTML) 4 Page - National Semiconductor (TI)

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5.0V Electrical Characteristics Unless otherwise specified, all limits are guaranteed to T
J = 25˚C.
VDD = 5.0V. Boldface limits apply at temperature extremes (Note 4). (Continued)
Symbol
Parameter
Condition
Min
Typ
Max
Units
Error Amplifier
GBW
Gain-Bandwidth Product
(Note 8)
5.7
MHz
V
O
Output Swing from Rail
From Positive Rail, Sourcing,
I
O =7mA
31
80
105
mV
From Negative Rail Sinking,
I
O =−7mA
35
80
105
I
O
Output Short Circuit Current
(Note 3)
Sourcing, V
O = 4.8V
15
31.5
mA
Sinking, V
O = 0.2V
15
31.5
e
n
Output Referred Noise
f
MEASURE = 10 kHz,
RF Input = 1800 MHz,
-10dBm, 20 k
Ω // 68 pF
between V
COMP1 and VCOMP2,
V
OUT = 1.4V, set by VRAMP,
(Note 8)
770
nV/
SR
Slew Rate
2.5
4.9
V/µs
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
Note 2: Human body model: 1.5 k
Ω in series with 100 pF.
Note 3: The output is not short circuit protected internally. External protection is necessary to prevent overheating and destruction or adverse reliability.
Note 4: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of
the device such that TJ =TA. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA.
Note 5: Power in dBV = dBm + 13 when the impedance is 50
Ω.
Note 6: The maximum power dissipation is a function of TJ(MAX) , θJA and TA. The maximum allowable power dissipation at any ambient temperature is PD =
(TJ(MAX) -TA)/θJA. All numbers apply for packages soldered directly into a PC board.
Note 7: All limits are guaranteed by design or statistical analysis.
Note 8: Typical values represent the most likely parametric norm.
Note 9: Slope and intercept are calculated from graphs "VOUT vs. RF input power" where the current is obtained by division of the voltage by 20 kΩ.
Connection Diagrams
LLP-10
Bond Pad Layout
20079502
Top View
20079503
Top View
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