08055C datasheet(17/20 Pages) AVX

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Surface Mounting Guide

MLC Chip Capacitors

Component pads should be designed to achieve good

solder filets and minimize component movement during

reflow soldering. Pad designs are given below for the most

common sizes of multilayer ceramic capacitors for both

wave and reflow soldering. The basis of these designs is:

• Pad width equal to component width. It is permissible to

decrease this to as low as 85% of component width but it

is not advisable to go below this.

• Pad overlap 0.5mm beneath component.

• Pad extension 0.5mm beyond components for reflow and

1.0mm for wave soldering.

Case Size

0402

1.70 (0.07)

0.60 (0.02)

0.50 (0.02)

0.60 (0.02)

0.50 (0.02)

0603

2.30 (0.09)

0.80 (0.03)

0.70 (0.03)

0.80 (0.03)

0.75 (0.03)

0805

3.00 (0.12)

1.00 (0.04)

1.25 (0.05)

1206

4.00 (0.16)

1.00 (0.04)

2.00 (0.09)

1.00 (0.04)

1.60 (0.06)

1210

4.00 (0.16)

1.00 (0.04)

2.00 (0.09)

1.00 (0.04)

2.50 (0.10)

1808

5.60 (0.22)

1.00 (0.04)

3.60 (0.14)

1.00 (0.04)

2.00 (0.08)

1812

5.60 (0.22)

1.00 (0.04))

3.60 (0.14)

1.00 (0.04)

3.00 (0.12)

1825

5.60 (0.22)

1.00 (0.04)

3.60 (0.14)

1.00 (0.04)

6.35 (0.25)

2220

6.60 (0.26)

1.00 (0.04)

4.60 (0.18)

1.00 (0.04)

5.00 (0.20)

2225

6.60 (0.26)

1.00 (0.04)

4.60 (0.18)

1.00 (0.04)

6.35 (0.25)

Dimensions in millimeters (inches)

REFLOW SOLDERING

WAVE SOLDERING

Component Spacing

For wave soldering components, must be spaced sufficiently

far apart to avoid bridging or shadowing (inability of solder

to penetrate properly into small spaces). This is less impor-

tant for reflow soldering but sufficient space must be

allowed to enable rework should it be required.

Preheat & Soldering

The rate of preheat should not exceed 4°C/second to

prevent thermal shock. A better maximum figure is about

2°C/second.

For capacitors size 1206 and below, with a maximum

thickness of 1.25mm, it is generally permissible to allow a

temperature differential from preheat to soldering of 150°C.

In all other cases this differential should not exceed 100°C.

For further specific application or process advice, please

consult AVX.

Cleaning

Care should be taken to ensure that the capacitors are

thoroughly cleaned of flux residues especially the space

beneath the capacitor. Such residues may otherwise

become conductive and effectively offer a low resistance

bypass to the capacitor.

Ultrasonic cleaning is permissible, the recommended

conditions being 8 Watts/litre at 20-45 kHz, with a process

cycle of 2 minutes vapor rinse, 2 minutes immersion in the

ultrasonic solvent bath and finally 2 minutes vapor rinse.

Case Size

0603

3.10 (0.12)

1.20 (0.05)

0.70 (0.03)

1.20 (0.05)

0.75 (0.03)

0805

4.00 (0.15)

1.50 (0.06)

1.00 (0.04)

1.50 (0.06)

1.25 (0.05)

1206

5.00 (0.19)

1.50 (0.06)

2.00 (0.09)

1.50 (0.06)

1.60 (0.06)

1210

5.00 (0.19)

1.50 (0.06)

2.00 (0.09)

1.50 (0.06)

2.50 (0.10)

Dimensions in millimeters (inches)

≥1mm (0.04)

≥1.5mm (0.06)

≥1mm (0.04)

Component Pad Design

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