11

HMC8074LP6GE

v0 .0319

QUADBAND MMIC VCO

8.3 - 15.2 GHz

For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106

Phone: 781-329-4700 • Order online at www.analog.com

Application Support: Phone: 1-800-ANALOG-D

Outline Drawing

Package Information

Part Number

Package Body Material

Lead Finish

MSL Rating

HMC8074LP6GE

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

H8074

XXXX

HMC8074LP6GETR

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

H8074

XXXX

[2] 4-Digit lot number XXXX

0.50

BSC

BOTTOM VIEW

TOP VIEW

SIDE VIEW

EXPOSED

PAD

0.05 MAX

0.02 NOM

0.20 REF

4.50 REF

COPLANARITY

0.08

0.30

0.25

0.20

6.10

6.00 SQ

5.90

0.90

0.85

0.80

0.20 MIN

4.75

4.70 SQ

4.65

40

1

11

10

20

21

30

31

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

SEATING

PLANE

PIN 1

INDICATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

*COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-5

WITH EXCEPTION TO LEAD LENGHT

PIN 1

INDICATOR

AREA

*0.35

0.30

0.25

40-Lead Lead Frame Chip Scale Package [LFCSP]

6 mm × 6 mm Body and 0.85 mm Package Height

(HCP-40-1)

Dimensions shown in millimeters