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ADRF5046BCCZN-R7 bảng dữ liệu(PDF) 5 Page - Analog Devices

tên linh kiện ADRF5046BCCZN-R7
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ADRF5046BCCZN-R7 bảng dữ liệu(HTML) 5 Page - Analog Devices

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Data Sheet
ADRF5046
Rev. 0 | Page 5 of 15
ABSOLUTE MAXIMUM RATINGS
For recommended operating conditions, see Table 1.
Table 2.
Parameter
Rating
Supply Voltage
Positive
−0.3 V to +3.6 V
Negative
−3.6 V to +0.3 V
Digital Control Inputs Voltage
−0.3 V to VDD +0.3 V
RFx Input Power (f1 = 200 MHz to 40 GHz,
TCASE = 85°C2)
Through Path
27.5 dBm
Hot Switching
27.5 dBm
Temperature
Junction, TJ
135°C
Storage Range
−65°C to +150°C
Reflow
260°C
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
RFx Pins
500 V
Supply and Digital Control Pins
2000 V
1 For power derating over frequency, see Figure 2 and Figure 3.
2 For 105°C operation, the power handling degrades from the TCASE = 85°C
specification by 3 dB.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Only one absolute maximum rating can be applied at any one time.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θJC is the junction to case bottom (channel to package bottom)
thermal resistance.
Table 3. Thermal Resistance
Package Type
θJC
Unit
CC-20-6, Through Path
240
°C/W
POWER DERATING CURVES
2
–14
10k
100G
FREQUENCY (Hz)
–12
–10
–8
–6
–4
–2
0
100k
1M
10M
100M
1G
10G
Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TCASE = 85°C
36
50
FREQUENCY (GHz)
2
–14
–12
–10
–8
–6
–4
–2
0
37 38 39 40 41
43
45
47
49
42
44
46
48
Figure 3. Power Derating vs. Frequency, High Frequency Detail, TCASE = 85°C
ESD CAUTION



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