ADMV4420ACPZ-R2 datasheet(7/61 Pages) AD

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Data Sheet

ADMV4420

Rev. A | Page 7 of 61

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage (VVPOS1_VCO, VVPOS2_PLL,

VVPOS3_CP, and VVPOS4_IF

5.5 V

Digital Input/Output Signal (SCLK, SDI,

SDO, CS, ENBL1, and ENBL0)

3.6 V

RFIN

0 dBm

Source and Sink Current (MUXOUT)

300 µA

Maximum Junction Temperature

125°C

Peak Reflow Temperature

260°C

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

Electrostatic Discharge (ESD) Sensitivity

Human Body Model (HBM)

500 V1

2000 V2

1500 V3

Field Induced Charged Device Model

(FICDM)1

500 V

Applies to all pins of the ADMV4420.

Applies to all pins except the MUXOUT, ENBL0, ENBL1, SDO, SDI, SCLK, and

CS pins.

Applies to the MUXOUT, ENBL0, ENBL1, SDO, SDI, SCLK, and CS pins.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

60 SECONDS

TO 180 SECONDS

20 SECONDS

TO 40 SECONDS

480 SECONDS MAX

TIME (Seconds)

260°C –5°C/+0°C

150°C TO 200°C

RAMP DOWN

6°C/SEC MAX

217°C

RAMP UP

3°C/SEC MAX

60 SECONDS

150 SECONDS

Figure 2. Pb-Free Reflow Solder Profile

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient measured in a

one cubic foot sealed enclosure. θJC is the junction to case

thermal resistance.

Table 3. Thermal Resistance

Package Type

θJC1

θJA1

Unit

CP-32-12

7.25

39.6

°C/W

The θJA and θJC values are determined by measuring the thermally

designed PCB with a heat sink.

ESD CAUTION

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