VITESSE

SEMICONDUCTOR CORPORATION

Preliminary Data Sheet

VSC7958

2.5Gb/s High Speed Limiting Post Amplifier

for OC-48/SDH-16 Applications

Page 6

G52184-0, Rev 3.0

05/14/01

© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012

Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com

Internet: www.vitesse.com

Die Information

Figure 4: Die Pad Information

VSC7958

Top View

Maximum Total Die Size:

1233

µm x 1705µm

Die Thickness:

305

µm

Pad Size:

100

µm x 100µm

Pad Passivation Opening:

90

µm x 90µm

This device requires external components when used in die form.

Please contact your Vitesse sales representative for information.

Pad 16

VBR

Pad 15

VSS_C

Pad 14

VSS

Pad 13

VSS

Pad 12

VDD

Pad 11

VDD

Pad 10

VDD

Pad 9

EDGE_SENSE

Pad 15

GND

Pad 5

VDD

Pad 4

VDD

Pad 8

VDD

Pad 7

VDD

Pad 6

VOUT_N

1233

µm

1705

µm

Pad 3

VOUT_P

Pad 2

VDD

Pad 20

VIN_N

Pad 21

VDD

Pad 22

VDD

Pad 23

VIN_P

Pad 24

VDD

Pad 17

VREFC_N

Pad 18

VREF_N

Pad 27

VBF

Pad 28

VBS

Pad 29

VDD

Pad 30

VDD

Pad 31

VDD

Pad 8

VDD

Pad 26

VREFC_P

Pad 25

VREF_P

Pad19

VDD